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| INCH-POUND MIL-M-38510/314C 14 July 2003 __ SUPERSEDING MIL-M-38510/314B 23 May 1978 MILITARY SPECIFICATION MICROCIRCUITS, DIGITAL, LOW-POWER SCHOTTKY, TTL, MONOSTABLE MULTIVIBRATORS, MONOLITHIC SILICON Inactive for new design after 18 April 1997. This specification is approved for use by all Departments and Agencies of the Department of Defense. www..com 1. SCOPE 1.1 Scope. This specification covers the detail requirements for monolithic silicon, low-power Schottky TTL, monostable multivibrator microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.3). 1.2 Part number. The part number should be in accordance with MIL-PRF-38535, and as specified herein. 1.2.1 Device types. The device types should be as follows: Device type 01 02 03 Circuit Dual monostable multivibrator, retriggerable, with clear Dual monostable multivibrator, Schmitt trigger inputs, with clear Single monostable multivibrator, retriggerable, with clear 1.2.2 Device class. The device class should be the product assurance level as defined in MIL-PRF-38535. 1.2.3 Case outlines. The case outlines should be as designated in MIL-STD-1835 and as follows: A B C D E F 2 GDFP5-F14 or CDFP6-F14 GDFP4-14 GDIP1-T14 or CDIP2-T14 GDFP1-F14 or CDFP2-F14 GDIP1-T16 or CDIP2-T16 GDFP2-F16 or CDFP3-F16 CQCC1-N20 14 14 14 14 16 16 20 Flat pack Flat pack Dual-in-line Flat pack Dual-in-line Flat pack Square leadless chip carrier Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAS, P. O. Box 3990, Columbus, OH 43216-5000, by using the self addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC N/A DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. w w w . at d sh a et e u. 4 om c FSC 5962 www..com Outline letter Descriptive designator Terminals Package style MIL-M-38510/314C 1.3 Absolute maximum ratings. Supply voltage range ............................................................................. Input voltage range ................................................................................ Storage temperature range .................................................................... Maximum power dissipation per flip-flop, (PD) 1/ Device type 01 ................................................................................. Device type 02 .................................................................................. Device type 03 .................................................................................. Lead temperature (soldering, 10 seconds) ............................................. Thermal resistance, junction to case (JC): Cases A, B, C, D, E, F, and 2 ............................................................... Junction temperature (TJ) 2/.................................................................... www..com -0.5 V dc to 7.0 V dc -1.5 V dc at -18 mA to 5.5 V dc -65 to +150C 110 mW dc 149 mW dc 61 mW dc 300C (See MIL-STD-1835) 175C 1.4 Recommended operating conditions. Supply voltage (VCC) .............................................................................. Minimum high level input voltage (VIH) ................................................... Maximum low level input voltage (VIL) .................................................... Case operating temperature range (TC) ................................................. Minimum pulse width .............................................................................. Input pulse rise/fall time, device type 02 Schmitt, B input ................................................................................ Logic, A input ................................................................................... Clear-inactive-state setup time Device type 02 ................................................................................. External timing resistance, Rext Device type 01, 03 ........................................................................... Device type 02 ................................................................................. External timing capacitance, Cext Device type 01, 03 ........................................................................... Device type 02 ................................................................................. Output duty cycle, device type 02 RT = 2 k ......................................................................................... TT = 70 k ........................................................................................ Wiring capacitance, Rext/Cext terminal Device type 01, 03 (referenced to GND) .......................................... 4.5 V dc minimum to 5.5 V dc maximum 2.0 V dc 0.7 V dc -55 to +125C 40 ns 1 V/s minimum 1 V/s minimum 15 ns minimum 5 k minimum, 180 k maximum 1.4 k minimum, 70 k maximum No restriction 1,000 F maximum 50% duty cycle maximum 90 % duty cycle maximum 50 pF maximum _______ 1/ Must withstand the added PD due to short-circuit test (e.g., IOS). 2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with MIL-PRF-38535. 2 MIL-M-38510/314C 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications and Standards. The following specifications and standards form a part of this specification to the extent specified herein. Unless otherwise specified, the issues of these documents shall be those listed in the issue of the Departments of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 www..com Integrated Circuits (Microcircuits) Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 MIL-STD-1835 Test Method Standard for Microelectronics. Interface Standard Electronic Component Case Outlines (Unless otherwise indicated, copies of the above specifications and standards are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract award (see 4.3 and 6.4). 3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein. 3.3.1 Terminal connections and logic diagrams. The terminal connections and logic diagrams shall be as specified on figure 1. 3.3.2 Truth table and functional description. The truth table and functional description shall be as specified on figure 2. 3.3.3 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the qualifying activity and the preparing activity upon request. 3.3.4 Case outlines. The case outlines shall be as specified in 1.2.3. 3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6). 3 MIL-M-38510/314C 3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I, and apply over the full recommended case operating temperature range, unless otherwise specified. 3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table III. 3.7 Marking. Marking shall be in accordance with MIL-PRF-38535. 3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 10 (see MIL-PRF-38535, appendix A). 4. VERIFICATION www..com 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not effect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with, MIL-PRF-38535 and shall be conducted on all devices prior to qualification and quality conformance inspection. The following additional criteria shall apply: a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MILPRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters test prior to burn-in is optional at the discretion of the manufacturer. c. Additional screening for space level product shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535. 4.4 Technology Conformance Inspection (TCI). Technology conformance inspection shall be in accordance with MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 shall be omitted. 4 MIL-M-38510/314C TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified High level output voltage Low level output voltage Input clamp voltage www..com Device types All All All 01, 03 02 02 02 -160 -30 -30 -30 Limits Min 2.5 0.4 -1.5 -400 -680 -400 -580 20 100 -15 -130 11 20 11 27 5 5 5 5 5 5 5 5 57 113 74 90 75 105 75 128 Max Unit VOH VOL VIC IIL1 IIL2 VCC = 4.5 V, VIL = 0.7 V, VIH = 2.0 V, IOH = -400 A VCC = 4.5 V, VIL = 0.7 V, VIH = 2.0 V, IOL = 4 mA VCC = 4.5 V, IIN = -18 mA, TC = +25C VCC = 5.5 V, VIN = 0.4 V V V V A Low level input current Low level input current at clear input Low level input current at AIN Low level input current BIN High level input current High level input current Short circuit output current Supply current (quiescent) Supply current (quiescent or triggered) Supply current (triggered) Propagation delay time low to high level from input A Propagation delay time low to high level from input B Propagation delay time low to high level from clear Propagation delay time high to low level from input A See footnotes at end of table. IIH1 IIH2 IOS ICC1 ICC2 ICC3 tPLH1 tPLH2 tPLH3 tPHL1 VCC = 5.5 V, VIN = 2.7 V VCC = 5.5 V, VIN = 5.5 V VCC = 5.5 V, VIH = 5.5 V, VIL = GND VCC = 5.5 V All All All 02 01 03 02 A mA mA VCC = 5.0 V CL = 50 pF 5%, RL = 2 k 5% Cext = 1/ Rext = 1/ 01, 03 02 01, 03 02 01, 03 02 01, 03 02 ns 5 MIL-M-38510/314C TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Propagation delay time high to low level from input B Propagation delay time high to low level from clear www..com Device types 01, 03 02 01, 03 02 01, 03 02 02 02 01, 03 02 Limits Min Max 5 5 5 5 92 105 48 90 308 20 70 600 3.0 5.5 91 195 850 6.25 8.5 Unit tPHL2 VCC = 5.0 V CL = 50 pF 10% RL = 2k 5% ns tPHL3 Cext = 1/ Rext = 1/ ns Minimum pulse width of Q output Width of Q output pulse tP(MIN) tP1 tP2 tP3 tP4 tP5 VCC = 5.0 V CL = 50 pF 10% RL = 2k 5% Cext = 2/ 10% Rext = 2/ 10% ns s ms 1/ For propagation delay tests, see table III for Cext and Rext values. 2/ tP(MIN) test, Cext = open and Rext = 5 k. tP1 test, Cext = open and Rext = 2 k. tP2 test, Cext = 80 pF and Rext = 2 k. tP3 test, Cext = 100 pF and Rext = 10 k. tP4 test, Cext = 1,000 pF and Rext = 10 k. tP5 test, Cext = 1F and Rext = 10 k. 6 MIL-M-38510/314C TABLE II. Electrical test requirements. Subgroups (see table III) Class S Class B devices devices 1 1 1*, 2, 3, 7, 9, 10, 11 1, 2, 3, 7, 8, 9, 10, 11 1, 2, 3 9, 10, 11 1, 2, 3, 9, 10, 11 N/A 1, 2, 3 1*, 2, 3, 7, 9 1, 2, 3, 7, 8, 9 N/A 1, 2, 3 10, 11 1, 2, 3 MIL-PRF-38535 test requirements Interim electrical parameters Final electrical test parameters Group A test requirements www..com Group B electrical test parameters when using method 5005 QCI option Group C end-point electrical parameters Additional electrical subgroups for group C inspections Group D end-point electrical parameters *PDA applies to subgroup 1. 4.4.2 Group B inspection. Group B inspection shall be in accordance with table II MIL-PRF-38535. 4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. c. Subgroups 3 and 4 shall be added to group C inspection parameters for class B devices and shall consist of the tests, conditions, and limits specified for subgroups 10 and 11 of group A. 4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End-point electrical parameters shall be as specified in table II herein. 4.5 Methods of inspection. Methods of inspection shall be specified and as follows: 4.5.1 Voltage and current. All voltages given are referenced to the microcircuit ground terminal. Currents given are conventional and positive when flowing into the referenced terminal. 7 MIL-M-38510/314C www..com FIGURE 1. Terminal connections. 8 MIL-M-38510/314C www..com FIGURE 1. Terminal connections - Continued. 9 MIL-M-38510/314C www..com FIGURE 1. Terminal connections - Continued. 10 MIL-M-38510/314C Device type 01 and 02 INPUTS CLEAR L X X H H www..com OUTPUTS B X X L A X H X L Q L L L Q H H H H H L Device type 03 INPUTS A2 X H X X X X L L CLEAR L X X X H H H H H H H A1 X H X X L L X X H B1 X X L X B2 X X X L H OUTPUTS Q Q L L L L H H H H H H H H H H H H H H H H H H X L L X NOTES: 1. H = high level (steady state), L = low level (steady state), = transition from low to high level, = transition from high to low level, = one high level pulse, = one low level pulse, X = irrelevant (any input, including transitions). To use the internal timing resistor of device type 03 connect Rint to VCC. An external timing capacitor may be connected between Cext and Rext/Cext (positive). For accurate repeatable pulse widths, connect an external resistor between Rext/Cext and VCC with Rint open circuited. To obtain variable pulse widths, connect external variable resistance between Rint or Rext/Cext and VCC. 2. 3. 4. 5. FIGURE 2. Truth table and functional description. 11 MIL-M-38510/314C Device types 01 and 03 This multivibrator features d-c triggering from gated low level active (A inputs), and high level active (B inputs). Output pulse width is a function of external capacitor and resistor values. Retriggering of input before output terminates, extends output pulse width. Overriding clear feature permits termination of output pulse width at a predetermined time independent of R and C timing components. www..com NOTE: Retrigger pulse must not start before 0.22 Cext (in picofarads) nanoseconds after previous trigger pulse. FIGURE 2. Truth table and functional description - Continued. 12 MIL-M-38510/314C Device type 01 and 03 (Continued) The output pulse width (tp) is a function of the external capacitor and resistor values. For output pulse widths when Cext > 1,000 pF, tp is defined as : tp 0.4 RT Cext Where RT is in k, Cext is in pF, and tp is in ns. For output pulse widths when Cext < 1,000 pF, tp is defined as: www..com NOTE: This value of resistance exceeds the maximum recommended for use over the full temperature range FIGURE 2. Truth table and functional description - Continued. 13 MIL-M-38510/314C Device type 02 This multivibrator features a negative transition triggered input and a positive transition triggered input, either of which can be used as an inhibit input. Pulse triggering occurs at a particular voltage level, not directly related to transition time of input pulse. Once fired, the outputs are independent of further transitions of A and B inputs, and are a function of the timing components. Output pulses can be terminated by the overriding clear, independent of R and C timing components. www..com FIGURE 2. Truth table and functional description - Continued. 14 MIL-M-38510/314C Device type 02 (Continued) The output pulse width (tp) is a function of the external capacitor and resistor values. The output pulse width is defined as : tp 0.7 RT Cext Where RT is in k, Cext is in pF, and tp is in ns. www..com FIGURE 2. Truth table and functional description - Continued. 15 MIL-M-38510/314C www..com TIMING COMPONENT CONNECTIONS FIGURE 2. Truth table and functional description - Continued. 16 MIL-M-38510/314C www..com FIGURE 3. Switching test circuit and waveforms for device types 01 and 03. 17 MIL-M-38510/314C www..com NOTES: 1. Pulse generator has the following characteristics: PRR 1.0 MHz, tPIN 40 ns, tTHL 6 ns, tTLH 15 ns, and ZOUT = 50. 2. See table III notes for Rext, Cext values. 3. CL = 50 pF 10% including scope probe, wiring and stray capacitance, without package in test fixture. 4. All diodes are 1N3064, or 1N916 or equivalent. 5. Load circuit on a given output is only required where the specified test in table III indicates "OUT" on that output. 6. tSETUP (max) shall be 50% of the typical output pulse width for the actual Cext used (see figure 2). FIGURE 3. Switching test circuit and waveforms for device types 01 and 03 - Continued. 18 MIL-M-38510/314C www..com FIGURE 4. Switching test circuit and waveforms for device type 02. 19 MIL-M-38510/314C www..com NOTES: 1. Pulse generator has the following characteristics: PRR 1.0 MHz, tPIN 40 ns, tTHL 6 ns, tTLH 15 ns, tSETUP1 (CLEAR INACTIVE) = 15 ns and ZOUT = 50. 2. See table III notes for Rext, Cext values. 3. CL = 50 pF 10% including scope probe, wiring and stray capacitance, without package in test fixture. 4. All diodes are 1N3064, or 1N916 or equivalent. 5. Load circuit on a given output is only required where the specified test in table III indicates "OUT" on that output. 6. tSETUP (max) shall be 50% of the typical output pulse width for the actual Cext used (see figure 2). FIGURE 4. Switching test circuit and waveforms for device type 02 - Continued. 20 TABLE III. Group A inspection for device type 01. Terminal conditions (pins not designated may be high 2.0 V, low 0.7 V, or open). 1 2 A1 B1 CLR1 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 Measured terminal Limits 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Unit www..com MIL- Cases E, F Subgroup Symbol STD-883 method - Case 2 Test no. Q1 -.4 mA " " 2.0 V C 4 mA GND 2.0 V C 4 mA 0.7 V 2.0 V 2.0 V 2.0 V " " 2.0 V 2.0 V Q2 Q2 Q1 Q1 Q2 0.7 V 2.0 V -.4 mA -.4 mA GND -.4 mA GND " " Q1 Q1 " " " GND 4.5 V 2.5 Q2 Q2 Min Cext2 Rext2 GND A2 B2 CLR2 Q1 Cext1 Rext1 VCC Max V " " 0.4 " " " " " " " " 1 C 2.0 V 2.0 V VOH 3006 1 2.0 V 0.7 V 2.0 V Tc = 25C " " 2.0 V C 4 mA 4 mA GND -18 mA -18 mA -18 mA -18 mA -18 mA " " 0.7 V 2.0 V 2.0 V 2.0 V " " " " " " 2 3 VOL " 3007 " 4 5 6 " " 7 8 VI C -18 mA 0.4 V 0.4 V 0.4 V 0.4 V 0.4 V 0.4 V IIL1 See note K -160 " " " " " IIH1 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V MIL-M-38510/314C 21 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V GND GND C C 4.5 V 4.5 V " " " GND GND GND GND " " GND GND C C GND GND 4.5 V 4.5 V GND GND 4.5 V 4.5 V 4.5 V 4.5 V " GND GND GND " GND GND GND IIH2 Q2 A1 B1 CLR1 A2 B2 CLR2 A1 B1 CLR1 A2 B2 CLR2 A1 B1 CLR1 A2 B2 CLR2 A1 B1 CLR1 A2 B2 CLR2 " " " " " " 5.5 V " " " " " " " " " " " " " " " " " " " GND GND GND GND GND GND " " " " " " Q1 Q1 Q1 Q1 Q2 Q2 Q2 Q2 IOS 3009 " " " " " 3010 " " " " " " " " " " " 3011 " " " " " " " " " " " " " " " " " " " " " " " " " -15 -30 -15 -30 -15 -30 -15 -30 -1.5 " " " " " -400 " " " " " 20 " " " " " 100 " " " " " -100 -130 -100 -130 -100 -130 -100 -130 " " " " " " A " " " " " " " " " " " " " " " " " mA " " " " " " " " " " " " " " 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 CKT A, D 33 CKT C 34 CKT A, D 34 CKT C 35 CKT A, D 35 CKT C 36 CKT A, D 36 CKT C See footnotes at end of this table. TABLE III. Group A inspection for device type 01. Terminal conditions (pins not designated may be high 2.0 V, low 0.7 V, or open). 1/ 1 2 A1 Q1 5.5 V C 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V VCC VCC Q2 B1 CLR1 Q2 Min Cext2 Rext2 GND A2 B2 CLR2 Q1 Cext1 Rext1 VCC Max 20 20 mA mA 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 Measured terminal Limits 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Unit www..com MIL- Cases E, F Subgroup Symbol STD-883 method - Case 2 Test no. A A B " " " " " " A A B B A " " B OUT IN GND 5.0 V IN 5.0 V 5.0 V OUT GND IN 5.0 V IN IN 5.0 V OUT OUT F F GND GND IN IN 5.0 V IN OUT OUT OUT IN GND 5.0 V IN 5.0 V 5.0 V L Open Open L G G OUT F F F L F L F F A B A " " B B A " " " " B B A B B B " " A B B A A B B A A B A " " " H " " L H " " L H " " L H " " " " L " " H L " " H L " " H L " " " " F " " " " " " " " " " " " " " " " F " " " " " " " " " " " " " " " " 5.0 V " " " " " " " " " " " " " " " " All outputs " " " " " " " " " " " " " " " See notes A, B, D, E and F " " " " " " " " " " " " " " MIL-M-38510/314C 22 L F IN GND F OUT GND IN GND OUT OUT OPEN OPEN G G IN 5.0 V IN IN 5.0 V 5.0 V L L F " IN 5.0 V OUT " 5.0 V 5.0 V OUT " F " L " " " " " " " 1 ICC2 3005 37 5.5 V 5.5 V 5.5 V GND 3005 38 C 5.5 V 5.5 V GND Tc = 25C 2 Same tests, terminal conditions, and limits as for subgroup 1, except TC = +125C and VIC tests are omitted. 3 Same tests, terminal conditions, and limits as for subgroup 1, except TC = -55C and VIC tests are omitted. 7 Truth 3014 39 A A B H L F F GND " 40 A B " " " " " " Tc = 25C table tests " 41 B A " " " " " " " 42 " " A L H " " " " 43 " " B H L " " " " 44 " B B " " " " " " 45 " B A " " " " " " 46 " A A L H " " " " 47 " " B H L " " " " 48 A " B " " " " " " 49 A " A " " " " " " 50 B " A L H " " " " 51 B B B H L " " " " 52 A B A " " " " " " 53 " A " " " " " " " 54 " B " " " " " " " 55 B B " " " " " " 8 Repeat subgroup 7 at TC = +125C and TC = -55C. 9 tPLH1 3003 56 IN 5.0 V 5.0 V GND Fig. 3 57 OUT F F " Tc = 25C tPLH2 " 58 OUT F F " " 59 GND IN 5.0 V " tPLH3 " 60 GND IN IN OUT " 5.0 V " " " " " " " " " A1 to Q1 A2 to Q2 B2 to Q2 B1 to Q1 CLR1 to Q1 CLR2 to Q2 A2 to Q2 A1 to Q1 B1 to Q1 B2 to Q2 5 " " " " " " " " " " " 38 38 49 49 50 " " " 61 61 ns " " " " " " " " " " 61 tPHL1 " 62 " 63 tPHL2 " 64 " 65 tPHL3 tP(MIN) " " " " " " 66 67 68 69 70 71 " " " " " " CLR2 to Q2 CLR1 to Q1 Q1 Q1 Q2 Q2 32 32 205 " " " " " " " " " See footnotes at end of this table. TABLE III. Group A inspection for device type 01. Terminal conditions (pins not designated may be high 2.0 V, low 0.7 V, or open). 1/ 1 2 A1 Q1 OUT OUT IN GND 5.0 V IN 5.0 V 5.0 V OUT OUT I I I I I I I I GND " " " GND IN IN 5.0 V 5.0 V 5.0 V 5.0 V " " " Q2 Q2 Q1 Q1 3.5 " " " Q2 B1 CLR1 Q2 Min Cext2 Rext2 GND A2 B2 CLR2 Q1 Cext1 Rext1 VCC Max 6.0 " " " s " " " www..com 2 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 Measured terminal Limits 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Unit MIL- Cases E, F Subgroup Symbol STD-883 method - Case 2 Test no. 9 Tc = 25C tP4 3003 Fig. 3 " " 72 73 74 75 10 11 Same tests and terminal conditions as subgroup 9, except TC = +125C and limits are as follows: tPLH1 is 5 to 57 ns; tPLH2 is 5 to 74 ns; tPLH3 is 5 to 75 ns; tPHL1 is 5 to 75 ns; tPHL2 is 5 to 92 ns; tPHL3 is 5 to 48 ns; tP(MIN) is 308 ns; and tP4 is 3.0 to 6.25 s. Same tests and terminal conditions as for subgroup 10, except TC = -55C NOTES: A. VIN = 3.0 V minimum. B. VIN = 0.0 V or GND. - - - 2.5 V min/5.5 V max. 0 V C. Apply input pulse MIL-M-38510/314C 23 D. Test numbers 39 through 55 shall be run in sequence. E. Output voltages shall be either: H > 1.5 V; L < 1.5 V F. Rext = 5 k minimum to 180 k maximum, connected to VCC; Cext 1,000 F, connected to Rext terminal. G. Rext = 5 k 10%, connected to VCC. I. Rext = 10 k 10%, connect to VCC; Cext 1,000 F 10%, connected to Rext terminal. J. During subgroups 9, 10, 11 testing, Rext and Cext may remain applied on the side of the device not under test if desired. K. For circuit D, IIL1 limits are 120 mA to 360 mA. L. Rext = 10 k 10%, connect to VCC; Cext 45 pF connected to Rext terminal. TABLE III. Group A inspection for device type 02. Terminal conditions (pins not designated may be high 2.0 V, low 0.7 V, or open). 1 2 A1 Q1 -.4 mA " " 2.0 V C 4 mA GND 2.0 V C 4 mA 0.7 V 2.0 V 2.0 V 2.0 V " " GND 2.0 V 2.0 V Q2 Q2 Q1 Q1 Q2 Q2 0.7 V 2.0 V -.4 mA -.4 mA 2.0 V C 4 mA 4 mA GND -18 mA -18 mA -18 mA -18 mA -18 mA GND " " 0.7 V 2.0 V 2.0 V 2.0 V GND GND " " " " " " -.4 mA GND GND " " Q1 Q1 " " " 0.4 " " " GND 4.5 V 2.5 Q2 2.0 V C 2.0 V 2.0 V 0.7 V 2.0 V B1 CLR1 Q2 Min Cext2 See L Rext2 See L GND A2 B2 CLR2 Q1 Cext1 See L Rext1 See L VCC Max V " " " " " " " 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 Measured terminal Limits 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Unit www..com MIL- Cases E, F Subgroup Symbol STD-883 method - Case 2 Test no. 1 VOH 3006 1 Tc = 25C " " 2 3 VOL " 3007 " 4 5 6 " " 7 8 VI C -18 mA IIL2 " " GND " " " " 0.4 V " " GND " " " " " " 4.5 V 4.5 V " " 0.4 V 4.5 V 4.5 V GND " " " " " " " GND GND 2.7 V 4.5 V 4.5 V 2.7 V GND GND 2.7 V GND GND " " " " " " GND GND 4.5 V GND " " " " " " " " " 0.4 V " " " " " " 3009 0.4 V 4.5 V 4.5 V " " " " " " " " " " " " " 5.5 V " " " " " GND GND GND GND " A1 B1 CLR1 A2 B2 CLR2 A1 A1 A1 B1 B1 B1 CLR1 -100 -30 -160 -160 -30 -200 -200 -1.5 " " " " " -340 -300 -400 -580 -300 -440 -680 " " " " " " A " " " " " " " " " " " " MIL-M-38510/314C 24 2.7 V 4.5 V 4.5 V 2.7 V GND 5.5 V 4.5 V 4.5 V 5.5 V GND GND 5.5 V " " " " " " " " " " " " " 5.5 V 4.5 V 4.5 V 5.5 V GND " " 4.5 V " " " " " " " " CLR1 A2 A2 A2 B2 B2 B2 CLR2 -30 -100 -30 -160 -160 -30 -200 -200 -30 -300 -340 -300 -400 -580 -300 -440 -680 " " " " " " " " " " " " " " IIH1 GND 2.7 V IIH2 " 3010 " " " " " " " " " " " 9 10 11 12 13 14 15 CKT A, C, D 15 CKT B 15 CKT E 16 CKT A, C 16 CKT B 16CKT E, D 17 CKT A,C,D,E 17 CKT B 18 CKT A, C, D 18 CKT B 18 CKT E 19 CKT A, C 19 CKT B 19 CKT E, D 20 CKT A,C,D,E 20 CKT B 21 22 23 24 25 26 27 28 29 30 31 32 GND 5.5 V " " " " " " " " " " " " " CLR2 A1 B1 CLR1 A2 B2 CLR2 A1 B1 CLR1 A2 B2 CLR2 -300 20 " " " " " 100 " " " " " " " " " " " " " " " " " " See footnotes at end of this table. TABLE III. Group A inspection for device type 02 - Continued. Terminal conditions (pins not designated may be high 2.0 V, low 0.7 V, or open). 1 2 A1 Q1 GND " " GND Q2 Q2 Q2 Q2 " " 5.5 V C GND 5.5 V 5.5 V 5.5 V " " Q1 Q1 VCC VCC GND C C 4.5 V 4.5 V " 4.5 V 4.5 V " GND GND GND " GND GND GND " GND GND GND GND GND GND GND " GND GND GND " GND GND " GND GND " GND GND GND " " Q1 GND 5.5 V Q1 -15 -30 -15 -30 -15 -30 -15 -30 Q2 C C 4.5 V 4.5 V 4.5 V 4.5 V B1 CLR1 Q2 Min Cext2 See L Rext2 See L GND A2 B2 CLR2 Q1 VCC Max -100 -130 -100 -130 -100 -130 -100 -130 11 27 mA " " " " " " " " " 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 Measured terminal Limits 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Unit www..com MIL- Cases E, F Subgroup Symbol STD-883 method - Case 2 Test no. 1 IOS 3011 Cext1 See L GND Rext1 See L GND Tc = 25C " " " 33 CKT A, B, D, E 33 CKT C 34 CKT A, B, D, E 34 CKT C " " " " 35 CKT A, B, D, E 35 CKT C 36 CKT A, B, D, E 36 CKT C See notes A, B, D, E, and F MIL-M-38510/314C 25 ICC1 3005 37 5.5 V GND 5.5 V " ICC3 3005 38 C 5.5 V 5.5 V " 2 Same tests, terminal conditions, and limits as for subgroup 1, except TC = +125C and VIC tests are omitted. 3 Same tests, terminal conditions, and limits as for subgroup 1, except TC = -55C and VIC tests are omitted. 7 Truth 3014 39 A A B H L F F GND " 40 A B " " " " " " Tc = 25C table tests " 41 B A " " " " " " " 42 " " A L H " " " " 43 " " B H L " " " " 44 " B B " " " " " " 45 " B A " " " " " " 46 " A A L H " " " " 47 " " B H L " " " " 48 A " B " " " " " " 49 A " A " " " " " " 50 B " A L " " " " " 51 " " B H " " " " " 52 " " " " " " " " " 53 " " " " H " " " " 54 " B " " L " " " " 55 A B A " " " " " " 56 " A " " " " " " " 57 " B " " " " " " " 58 B B " " " " " " 8 Repeat subgroup 7 at TC = +125C and TC = -55C. A A B " " " " " " A " " " " B B A " " B A B A " " B B A " " " " " " " B B A B B B " " A B B A A B " " " " A A B A " " " H " " L H " " L H " " " " " L H " " " " L " " H L " " H L " " H L " " " " " " " F " " " " " " " " " " " " " " " " " " " F " " " " " " " " " " " " " " " " " " " 5.0 V " " " " " " " " " " " " " " " " " " " All outputs " " " " " " " " " " " " " " " " " " See footnotes at end of this table. TABLE III. Group A inspection for device type 02 - Continued. Terminal conditions (pins not designated may be high 2.0 V, low 0.7 V, or open). 1 2 A1 Q1 OUT IN GND OUT GND IN F F GND GND OUT OUT " OUT IN IN OUT OUT GND " " " IN IN 5.0 V 5.0 V " " OUT G " " OUT OUT G " " " " " " " " IN " 5.0 V 5.0 V 5.0 V " " IN IN IN 5.0 V OUT F " " F " 5.0 V 5.0 V OUT " IN IN OUT " F N F N CLR1 to Q1 CLR2 to Q2 A2 to Q2 A1 to Q1 B1 to Q1 5.0 V IN 5.0 V 5.0 V F F OUT OUT GND GND OUT N F IN GND F OUT GND IN IN OUT OUT OUT " OUT OUT " OUT IN IN OUT OUT " GND " " " OUT OUT OUT " OUT OUT " J " " I " I " " " J " " " " " " " " " " " OUT IN IN GND " " " IN 5.0 V 5.0 V IN " " " 5.0 V 5.0 V " " " " " " OUT OUT IN IN 5.0 V " 5.0 V " " " " " " " " " " IN " 5.0 V 5.0 V 5.0 V " " " " " " " " " G " " G " " " " " " OPEN " K " " " " " GND GND IN IN IN 5.0 V 5.0 V IN 5.0 V N OPEN " N N F " IN 5.0 V OUT " 5.0 V 5.0 V OUT " F " N " IN IN 5.0 V IN F F F F Q2 IN 5.0 V 5.0 V B1 CLR1 Q2 VCC Min Cext2 Rext2 GND A2 B2 CLR2 Q1 Cext1 Rext1 Max 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 Measured terminal Limits 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Unit www..com MIL- Cases E, F Subgroup Symbol STD-883 method - Case 2 Test no. 9 Tc = 25C tPLH1 tPLH2 tPLH3 3003 Fig. 4 " " " " " " " " B2 to Q2 CLR2 to Q2 CLR1 to Q1 Q1 N K " " " " " " " " " " " " Q1 Q1 Q1 Q2 Q2 Q2 Q2 Q2 OUT OUT " " " " " " " " " I " " " " I " " " " " " " " " " " Q2 Q2 Q2 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q2 Q2 Q2 Q2 Q2 OUT OUT " " " " Q2 Q2 59 60 61 62 63 GND " " " " 5.0 V " " " " A1 to Q1 A2 to Q2 B2 to Q2 B1 to Q1 5 " " " " 75 75 60 60 70 70 85 85 70 70 ns " " " " " " " " " " 64 tPHL1 " 65 " 66 tPHL2 " 67 " 68 tPHL3 tP1 " " " " 69 70 71 72 " " " " " " 20 " " " " " " " 70 " " " " " " " 600 " " " " " " " 5.7 " " 60 60 75 " " " " " " " 160 " " " " " " " 775 " " " " " " " 8.0 " " " " " " " " " " " " " " " " " " " " " " " " " " " " ms " " " 73 MIL-M-38510/314C 26 " " " 74 75 76 " 77 tP2 " " " 78 79 80 " 81 " " " 82 83 84 " 85 tP3 " " " 86 87 88 " 89 " " " 90 91 92 " 93 tP5 " " " 94 95 96 " 97 See notes at end of this table. www..com TABLE III. Group A inspection for device type 02 - Continued. Terminal conditions (pins not designated may be high 2.0 V, low 0.7 V, or open). 1 2 A1 Q1 OUT IN IN OUT Q1 OUT " OUT " " " " " " " GND GND IN " IN " 5.0 V 5.0 V 5.0 V " OUT J " J " J J GND " " IN 5.0 V 5.0 V 5.0 V " " Q2 Q1 5.7 " " " " " " Q2 B1 CLR1 Q2 VCC Min Cext2 Rext2 GND A2 B2 CLR2 Q1 Cext1 Rext1 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 Measured terminal Limits Max 8.0 " " ms " " 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Unit MIL- Cases E, F Subgroup Symbol STD-883 method - Case 2 Test no. 9 Tc = 25C tP5 3003 Fig. 4 " 98 99 100 " 101 " 102 Q1 Q1 10 11 Same tests and terminal conditions as subgroup 9, except TC = +125C and limits are as follows: tPLH1 is 5 to 113 ns; tPLH2 is 5 to 90 ns; tPLH3 is 5 to 105 ns; tPHL1 is 5 to 128 ns; tPHL2 is 5 to 105 ns; tPHL3 is 5 to 90 ns; tP1 is 20 to 91 ns; tP2 is 70 to 195 ns; tP3 is 600 to 850 ns; and tP5 is 5.5 to 8.5 ms. Same tests and terminal conditions as for subgroup 10, except TC = -55C NOTES: A. VIN = 3.0 V minimum. B. VIN = 0.0 V or GND. - - - 2.5 V min/5.5 V max. 0 V C. Apply input pulse MIL-M-38510/314C D. Test numbers 39 through 58 shall be run in sequence. 27 E. Output voltages shall be either: H > 1.5 V; L < 1.5 V F. Rext = 1.4 k minimum to 70 k maximum, connected to VCC; Cext 1,000 F, connected to Rext terminal. G. Rext = 2 k 10%, connected to VCC; Cext = 80 pF 10%, connected to Rext terminal. I. Rext = 10 k 10%, connect to VCC; Cext = 100 pF 10%, connected to Rext terminal. J. Rext = 10 k 10%, connect to VCC; Cext = 1.0 F 10%, connected to Rext terminal. K. Rext = 2 k 10%, connect to VCC. L. Note F may apply during subgroups 1, 2, and 3 testing if desired. M. During subgroups 9, 10, 11 testing, Rext and Cext may remain applied on the side of the device not under test if desired. N. Rext = 10 k 10%, connect to VCC; Cext 45 pF connected to Rext terminal. TABLE III. Group A inspection for device type 03. Terminal conditions (pins not designated may be high 2.0 V, low 0.7 V, or open). 1 2 Min VCC Q 2.5 2.5 0.4 0.4 V " " " 3 4 6 8 9 10 12 13 14 16 18 19 20 Measured terminal Limits Max 2 3 4 5 6 7 8 9 10 11 12 13 14 Unit www..com Subgroup Symbol MIL-STD883 method A1 A2 B1 B2 CLR Case A,B,C,D Case 2 Test no. Q -.4 mA 4 mA GND -.4 mA GND " GND 4.5 V 4.5 V " GND NC Q Rint NC Cext (see I) 1 Tc = 25C VOH 3006 3006 1 2 0.7 V 2.0 V J 0.7 V 2.0 V " Rext Cext (see I) GND VOL 0.7 V -18 mA -18 mA -18 mA -18 mA -18 mA 0.4 V 4.5 V 0.4 V 4.5 V 0.4 V 2.7 V GND 2.7 V GND 2.7 V 5.5 V GND 5.5 V GND GND GND GND GND " 4.5 V J GND GND " " " " " GND 4.5 V J 5.5 V 4.5 V GND GND GND 4.5 V 4.5 V 5.5 V 5.5 V GND 5.5 V GND 5.5 V GND 2.7 V GND 2.7 V 4.5 V 0.4 V 4.5 V 0.4 V 2.0 V 4 mA 3007 3007 3 4 0.7 V J " " " " 4.5 V GND " " Q Q VI C IIL1 see note C -160 " " " " IIH1 IIH2 MIL-M-38510/314C 28 L " " H L H L L IOS 3009 " " " " 3010 " " " " " " " " " 3011 " " " " " " " " " " " " " " " " " " " " " GND GND " " " " " " " " " " 5.5 V " " " " " " " " " " " " " " " Q A1 A2 B1 B2 CLR A1 A2 B1 B2 CLR A1 A2 B1 B2 CLR A1 A2 B1 B2 CLR Q Q -15 -30 -15 -1.5 " " " " -400 " " " " 20 " " " " 100 " " " " -100 -130 -100 " " " " " A " " " " " " " " " " " " " " mA " " " " Q " 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 CKT A,D 25 CKT C 26 CKT A,D 26 CKT C -30 -130 " Q VCC VCC 11 11 " " ICC1 3005 27 5.5 V 5.5 V GND GND 5.5 V " ICC2 3005 28 J J 5.5 V 5.5 V 5.5 V " 2 Same tests, terminal conditions, and limits as subgroup 1, except TC = 125C and VI C tests are omitted. 3 Same tests, terminal conditions, and limits as subgroup 1, except TC = -55C and VI C tests are omitted. 7 Truth 3014 29 B B B B B H GND " 29A A A B B B " " Tc = 25C table test " 30 A A A A A " " " 31 B B " " A L " " 321 " " " " B H " " 33 " " " " A L " " 34 " A B " B H " " 35 " " B " A H " K " " " " " " " K " " " " " " " 5.0 V " " " " " " " All outputs " " " " " " See notes A, B See footnotes at end of this table. TABLE III. Group A inspection for device type 03 - Continued. Terminal conditions (pins not designated may be high 2.0 V, low 0.7 V, or open). 1 2 Min VCC 3 4 6 8 9 10 12 13 14 16 18 19 20 Measured terminal Limits Max 2 3 4 5 6 7 8 9 10 11 12 13 14 Unit www..com Subgroup Symbol MIL-STD883 method A1 A2 B1 B2 CLR Case A,B,C,D Case 2 Test no. Q L H H L H H L H H L OUT OUT OUT OUT OUT " K GND K K K 5.0 V " A1 to Q B1 to Q CLR to Q A1 to Q B1 to Q M K K M " " " " GND " " " " " " " " " H L L H L L H L L H 5.0 V " " " " " " " " " All outputs " " " " " " " " GND NC Q Rint NC 7 Tc = 25C Truth table test A " " " " " " " " " 5.0 V IN 5.0 V 5.0 V IN 5.0 V IN 5.0 V 5.0 V IN IN 5.0 V 5.0 V IN 5.0 V 5.0 V 5.0 V 5.0 V A B B A " " " " " " A B A A B A A B A A Cext (see I) K " " " " " " " " " 5 Rext Cext (see I) K " " " " " " " " " See notes A, B 8 1 GND GND IN GND GND GND 5.0 V GND GND GND 3014 36 B A " 37 " " " 38 " " " 39 " " " 40 A " " 41 A " " 42 B " " 43 A " " 44 " " " 45 " B Repeat subgroup 7 at TC = +125 C and TC = -55 C. tPHL1 3003 46 IN 5.0 V 50 61 32 38 49 50 3.5 205 6.0 ns " " " " " " s Tc = 25C tPHL2 (Fig. 3) 47 tPHL3 tPLH1 tPLH2 tPLH3 " " " " 48 49 50 51 OUT " " " " M K K M 29 IN GND 5.0 V GND 5.0 V IN tP(MIN) tP4 " " 52 53 10 MIL-M-38510/314C 11 CLR to Q 5.0 V 5.0 V " OUT G " Q 5.0 V " OUT F N " Q Same tests and terminal conditions as subgroup 9 except TC = +125C and limits are as follows: tPHL1 is 50 to 75 ns; tPHL2 is 5 to 92 ns; tPHL3 is 5 to 48 ns; tPLH1 is 5 to 57 ns; tPLH2 is 5 to 74 ns; tPLH3 is 5 to 75 ns; tP(MIN) is 308 ns; and tP4 is 3.0 to 6.25 s. Same tests and terminal conditions as subgroup 10 except TC = -55C. NOTES: A. VIN = 3.0 V minimum. B. VIN = 0.0 V or GND. C. For circuit D, IIL1 limits are 120 to 360 mA. D. Test numbers 29 through 45 shall be run in sequence. E. Output voltages shall be either: H > 1.5 V; L < 1.5 V F. Cext connected to Rext/Cext through a 1,000 pF 10% capacitor. G. Rext/Cext connected to VCC through a 5 k 10% resistor. I. Note K may apply during subgroups 1, 2, and 3 testing if desired. J. Apply input pulse - - - 2.5 V min/5.5 V max. 0 V K. Rext/Cext connected to VCC through a 5 k to 180 k resistor, and Cext connected to Rext/Cext through a 1,000 F capacitor. M. Cext connected to Rext/Cext through A 45 pF capacitor, Rext/Cext connected to VCC through a 10 k 10% resistor. N. Rext/Cext connected to VCC through a 10 k 10% resistor. MIL-M-38510/314C 5. PACKAGING 5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When actual packaging of materiel is to be performed by DoD personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military Department of Defense Agency, or within the Military Department's System Command. Packaging data retrieval is available from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature which may be helpful, but is not mandatory.) 6.1 Intended use. Microcircuits conforming to this specification are intended for original equipment design applications and logistic support of existing equipment. 6.2 Acquisition requirements. Acquisition documents should specify the following: a. b. c. Title, number, and date of the specification. Complete part number (see 1.2). Requirements for delivery of one copy of the quality conformance inspection data pertinent to the device inspection lot to be supplied with each shipment by the device manufacturer, if applicable. Requirements for certificate of compliance, if applicable. Requirements for notification of change of product or process to contracting activity in addition to notification to the qualifying activity, if applicable. Requirements for failure analysis (including required test condition of method 5003 of MIL-STD-883), corrective action, and reporting of results, if applicable. Requirements for product assurance options. Requirements for special carriers, lead lengths, or lead forming, if applicable. These requirements should not affect the part number. Unless otherwise specified, these requirements will not apply to direct purchase by or direct shipment to the Government. Requirements for "JAN" marking. www..com d. e. f. g. h. j. 6.3 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M38510 in this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements now consist of this specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have been retained to avoid adversely impacting existing government logistics systems and contractor's parts lists. 6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not such products have actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be obtained from DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43123-1199. 30 MIL-M-38510/314C 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535, MIL-HDBK-1331, and as follows: GND ........................................... IIN ................................................ VIC ............................................... VIN ............................................... Ground zero voltage potential Current flowing into an input terminal Input clamp voltage Voltage level at an input terminal 6.6 Logistic support. Lead materials and finishes (see 3.4) are interchangeable. Unless otherwise specified, microcircuits acquired for Government logistic support will be acquired to device class B (see 1.2.2), lead material and finish A (see 3.4). Longer length leads and lead forming should not affect the part number. 6.7 Substitutability. The cross-reference information below is presented for the convenience of users. Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry www..com microcircuit types may not have equivalent operational performance characteristics across military temperature ranges or reliability factors equivalent to MIL-M-38510 device types and may have slight physical variations in relation to case size. The presence of this information should not be deemed as permitting substitution of generic-industry types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535. Military device type 01 02 03 Generic-industry type 54LS123, 74LS123 54LS221, 74LS221 54LS122, 74LS122 6.8 Manufacturers' designation. Manufacturers' circuits, which form a part of this specification, are designated as shown in table IV herein. TABLE IV. Manufacturers' designation. Manufacturers Device type 01 02 03 A Texas Instruments Inc. X X X B C National Signetics Corporation Semiconductor Corp X X X X D Motorola Inc X X X E Raytheon Company X 6.9 Changes from previous issue. Asterisks are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. Custodians: Army - CR Navy - EC Air Force - 11 DLA - CC Preparing activity: DLA - CC (Project 5962-1964) Review activities: Army - MI, SM Navy - AS, CG, MC, SH, TD Air Force - 03, 19, 99 31 STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL INSTRUCTIONS 1. The preparing activity must complete blocks 1, 2, 3, and 8. In block 1, both the document number and revision letter should be given. 2. The submitter of this form must complete blocks 4, 5, 6, and 7, and send to preparing activity. 3. The preparing activity must provide a reply within 30 days from receipt of the form. NOTE: This form may not be used to request copies of documents, nor to request waivers, or clarification of requirements on current contracts. Comments submitted on this form do not constitute or imply authorization to waive any portion of the referenced document(s) or to amend contractual requirements. I RECOMMEND A CHANGE: 1. DOCUMENT NUMBER 2. DOCUMENT DATE (YYYYMMDD) MIL-M-38510/314C 2003-07-14 3. DOCUMENT TITLE www..com MICROCIRCUITS, DIGITAL, LOW-POWER SCHOTTKY TTL, MONOSTABLE MULTIVIBRATORS, MONOLITHIC SILICON 4. NATURE OF CHANGE (Identify paragraph number and include proposed rewrite, if possible. Attach extra sheets as needed.) 5. REASON FOR RECOMMENDATION 6. SUBMITTER a. NAME (Last, First Middle Initial) c. ADDRESS (Include Zip Code) b. ORGANIZATION d. TELEPHONE (Include Area Code) (1) Commercial (2) DSN (If applicable) b. TELEPHONE (Include Area Code (1) Commercial 614-692-0536 7. DATE SUBMITTED (YYYYMMDD) 8. PREPARING ACTIVITY a. NAME Defense Supply Center, Columbus c. ADDRESS (Include Zip Code) DSCC-VA P. O. Box 3990 Columbus, Ohio 43216-5000 (2) DSN 850-0536 IF YOU DO NOT RECEIVE A REPLY WITHIN 45 DAYS, CONTACT: Defense Standardization Program Office (DLSC-LM) 8725 John J. Kingman Road, Suite 2533 Fort Belvoir, Virginia 22060-6221 Telephone (703)767-6888 DSN 427-6888 PREVIOUS EDITIONS ARE OBSOLETE. WHS/DIOR, Feb 99 DD Form 1426, FEB 1999 (EG) |
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